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  e l e c t r o n i c s i n c . 10/100base-tx interface module for nic/hub applications tel: (818) 892-0761 fax: (818) 894-5791 http://www.pca.com pca electronics, inc. 16799 schoenborn st. north hills, ca 91343 ? robust construction allows for toughest soldering processes ? complies with or exceeds ieee 802.3, 10/100base-tx standards ? guaranteed to operate with 8 ma dc bias at 105? ? add ?rc?after part number for rohs compliant ? operating temperature : -25? to +105? ? storage temperature : -25? to +125? ? wire insulation class : mw 83c ? 1500 vrms isolation EPF8264G & EPF8264G-rc product performance is limited to specified parameters. data is subject to change without prior notice. electrical parameters @ 25?c unless otherwise specified dimensions are in inches /mm ?.010 /.25 csf8264g & -rc rev. 2 8/23/07 jdg ? impedance : 100 w xmit / 100 w rcv ? rise time : 3.0 ns max. insertion loss (db max.) common mode rejection (db min.) return loss (db min.) crosstalk (db min.) between channels -35 10-100 mhz 1-80 mhz -1/-1 xmit/rcv @ 100 mhz -1.5/-1.5 xmit/rcv 1-10 mhz -40 1-30 mhz -18/-18 xmit/rcv 30-60 mhz -12/-12 xmit/rcv 60-100 mhz -10/-10 xmit/rcv @ 100 mhz xmit/rcv -30/-30 @ 500 mhz xmit/rcv -10/-10 1-30 mhz -59/-59 xmit/rcv ocl (?) 100 khz, 0.1 vrms 8 ma dc bias 350 cable side schematic transmit channel 16 tx+ td+ 1 td- 3 14 tx- 1ct : 1ct ct 2 15 ct receive channel rd- 8 rd+ 6 ct 7 11 rx+ 9 rx- 1ct : 1ct 10 ct package suggested solder pad layout pca EPF8264G(-rc) date code .490 (12.45) .270 (6.86) .230 (5.84) .350 (8.89) .010/.015 (.254/.381) .050 (1.27) .380 (9.65) .016/.022 (.406/.559) .008/.012 (.203/.305) .070 (1.78) 0?8 .035 (.889) .030 (.762) .050 (1.27) .055 (1.40) .410 (10.41) pin 1 i.d. notes : 1. lead finish 2. peak temperature rating 3. moisture sensitive levels 4. weight 5. packaging information (tube) (tape & reel) msl = 4 (72 hours, 30?/60%rh) EPF8264G-rc 245? 1.0 gram 40 pieces/tube 650 pieces/13?reel EPF8264G 225? msl = 3 (168 hours, 30?/60%rh) 1.0 gram 40 pieces/tube 650 pieces/13?reel snpb hot tin dip (sn) ? ? lead material : ni barrier over cu


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